MAC Meeting 30 April 2025
https://indico.cern.ch/event/1542594/
Hexaboards
- 530 / 600 LD boards (w/v3c) passed the QC
- Dead 1/2 chips !!!
- ~170 coming soon. Will go through FNAL
Alethea
- Bonding notes:
- Encapsulant level should not exceed the top of the hexaboard • Look at the module from the side, there should be no dome of encapsulant
- Backside bonds: • More is better
Rong-Shang
- Numbers dont add b/c not all modules have been tested
Bora:
- Nice pictures for [BROKEN LINK: HGC Slides for April 2023 Review]
Baseplates
- Leave May 40 Ti LD Full / 72 to UCSB (12 of each partial type Ti)
Engineering Report (Susanne)
- Final order (Partials Hexaboard PUTs from Xometry) were delivered 4/23
- Ordering transfer tape
- Determination of module placement specs
- Spare parts for MACS
UCSB Status
12 HD Ti modules for cassettes 3 HD "No tape test" Studies on binding the wrong cell